- HDI
- Package Substrate
- Rigid-Flexible
- BACKPLANE
- Probecard
- Heatsink and Metal Core
- Heavy Copper
- RF/Microwave
- HDI
- SEP's core technology and advanced capabilities are
driven by our focus on fabricating complex and
cutting edge High Density Interconnect (HDI) PCB's.
- Package Substrate
- Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
- Rigid-Flexible
- For over 10 years, SEP has been producing single to multilayer constructions of both Flexible and Rigid-Flexible circuits. We have a core flex circuit engineering team that supports the latest in...
- BACKPLANE
- With our combined backplane and assembly capabilities, SEP is structured to provide custom backplane solutions that deliver performance and overall value. Our key capabilities include ...
- Probecard
- SEP has an extensive background in producing technically advanced, high quality probe cards and tester interfaces. We have been supporting the Automatic Test Equipment (ATE) business ...
- Heatsink and Metal Core
- Whether using aluminum or other thermal interface materials to provide the necessary thermal management,
SEP has the experience in the design and fabrication of heatsink ...
- Heavy Copper
- Heavy copper can be used in a PCB for a variety of purposes, including high power distribution, heat dissipation, planar transformers, and power convertors.
- RF/Microwave
- SEP has considerable technical knowledge and 15 years manufacturing experience in the supply of complex microwave PTFE and mixed dielectric multilayer PCBs.
