SEP's core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's.
Through our endless effort, we can meet any design requirement of the small form factors that apply to the latest product applications,
such as, mobile device, tablet PC and other high technology products.
The list below shows SEP's entire features of HDI technology.
Feature
Fine line, microvia and registration technologies
i+N+i (i≥2) build up structure
Stacked and/or staggered copper filled via
Via in pad
Sequential Lamination
Buried Capacitance
High Tech Drilling Capability – Small hole drilling, Backdrilling
Lower Dk / Df material enables better signal transmission
performance
Qualified material and surface treatment for Lead-free process
Controlled Impedance (+/- 10% Standard - +/- 7% Advanced)
Edge Plating for Shielding Space Optimization and Assembly