- Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
- Due to a rapidly growing market and customer demand for the highest level of miniaturization in PCB manufacturing, SEP has invested in package substrate capabilities that support semiconductor level substrates, such as, CSP, FC CSP, PBGA, BOC, FMC, and SiP.

CSP (Chip Scale Packages)
Chip Scale Packaging (CSP) utilizes fine pattern technology, very small via's, ultra thin copper foil and build up structure for high density designs and flexibility. The CSP substrate provides high reliability in both connection and isolation.
- Feature

Fine patterning technology for high density design
Build up structure for high design flexibility
High reliability in connection and isolation
Adoption of low CTE material suitable for PoP
- Specifications

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Line and Space |
0.020mm / 0.020mm |
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Package Size |
3x3mm ~ 19x19mm |
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- Applications


Digital Baseband
Graphic Processor
Multimedia Controller
Application Processor