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- HOME > PCB > Package Substrate
- Package Substrate
- Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
- Due to a rapidly growing market and customer demand for the highest level of miniaturization in PCB manufacturing, SEP has invested in package substrate capabilities that support semiconductor level substrates, such as, CSP, FC CSP, PBGA, BOC, FMC, and SiP.
FC-CSP (Flip Chip) CSPFlip Chip CSP (FC CSP) utilizes flip chip bumping technology instead of wire bonding to connect the bump pads on the substrate directly to the bonding pads of the chip. With the high density layout and smaller package size, this technology provides cost reductions.
- Feature
High I/O Count and Short Interconnects.- High layout density.
- Cost reduction due to smaller package size.
- Fine pattern & Fine Bump Pitch
- Tight solder resist position tolerance
- Flip Chip Bumping Technology
- Specifications
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- Applications
- Mobile Application Processor
- Baseband
- SRAM, DRAM, Flash Memory
- Tel : +82-31-231-2228 Fax : +82-31-231-2229
Address : 2B-19L, 930, Gosaek-Dong, Gwonseon-gu, Suwon-Si, Gyeonggi-Do, Korea
Copyright⒞ 2013 SEP Co., Ltd. All rights reserved.
