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  • HOME > PCB > Package Substrate
  • Package Substrate
Package Substrate
  • Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
  • Due to a rapidly growing market and customer demand for the highest level of miniaturization in PCB manufacturing, SEP has invested in package substrate capabilities that support semiconductor level substrates, such as, CSP, FC CSP, PBGA, BOC, FMC, and SiP.
타이틀아이콘PBGA (Plastic Ball Grid Array)
Plastic Ball Grid Array (PBGA) connects the Chip to the substrate and encapsulates it with a plastic molding compound. The optimized substrate design provides enhanced thermal and electrical performance and dimensional stability to package on package.
  • Feature
  • 타이틀라인
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  • 아이콘 Optimization of substrate design considering thermal and electrical performance
  • 아이콘 Finer ball pitch and thinner package thickness
  • 아이콘 High electrical performance due to short wire length
  • 아이콘 Etch back process
  • 아이콘 Available both for Flip-chip & Wire bonding
  • 아이콘 High density wiring by Semi-additive process
  • 아이콘 Fine pattern formation to bond on trace technology
  • 아이콘 Substrate dimension stability to package on package
  • 아이콘 Leadless plate design for interconnection
  • Specifications
  • 타이틀라인
Item Specifications
Material BT Resin
Layer count 2~6
Line and Space 0.020mm / 0.020mm
Package Size 21x21mm ~ 35x35mm
Board Thickness 0.21mm
  • Applications
  • 타이틀라인
  • application
  • 아이콘 Microprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs
  • 아이콘 Graphics and PC chip sets
  • 아이콘 Cellular, wireless telecommunications, PCMCIA cards
  • 아이콘 Laptop PC's, video cameras, disc drives, PLDs