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- HOME > PCB > Package Substrate
- Package Substrate
- Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
- Due to a rapidly growing market and customer demand for the highest level of miniaturization in PCB manufacturing, SEP has invested in package substrate capabilities that support semiconductor level substrates, such as, CSP, FC CSP, PBGA, BOC, FMC, and SiP.
BOC (Board on Chip)Board On Chip (BOC) designs have the substrate bonded to the circuit side of the die, and wire bonds are connected between the conductors of the substrate and the bond pads on the die.
- Feature
Punched slots for Low cost and High Accuracy position- Low cost routed slots
- Fine patterning technology for high density design
- Reduce signal noise by using a short electrical path
- Specifications
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- Applications
- DRAM
- DDR2
- GDDDR4
- GDDDR5
- Tel : +82-31-231-2228 Fax : +82-31-231-2229
Address : 2B-19L, 930, Gosaek-Dong, Gwonseon-gu, Suwon-Si, Gyeonggi-Do, Korea
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