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  • HOME > PCB > Package Substrate
  • Package Substrate
Package Substrate
  • Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
  • Due to a rapidly growing market and customer demand for the highest level of miniaturization in PCB manufacturing, SEP has invested in package substrate capabilities that support semiconductor level substrates, such as, CSP, FC CSP, PBGA, BOC, FMC, and SiP.
타이틀아이콘FMC (Flash Memory Card)
Flash Memory Card (FMC) is the substrate for Flash Memory devices which store, read and write data easily.
  • Feature
  • 타이틀라인
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  • 아이콘 PSR surface planarization
  • 아이콘 Soft Au / hard Au plate & brightness
  • 아이콘 Substrate warpage control
  • Specifications
  • 타이틀라인
Item Specifications
Material BT Resin
Layer count 2~6
Line and Space 0.040mm / 0.040mm
Board Thickness 0.13mm
Surface Finish Hard Au 5um/0.5um, Soft Au 5um/0.3um
  • Applications
  • 타이틀라인
  • application
  • 아이콘 Flash Memory Card