- Package substrates offer mechanical base support and electrical connectivity between IC chips and the PCB supporting circuitry and protection, heat dissipation, and signal and power distribution.
- Due to a rapidly growing market and customer demand for the highest level of miniaturization in PCB manufacturing, SEP has invested in package substrate capabilities that support semiconductor level substrates, such as, CSP, FC CSP, PBGA, BOC, FMC, and SiP.

FMC (Flash Memory Card)
Flash Memory Card (FMC) is the substrate for Flash Memory devices which store, read and write data easily.
- Feature

PSR surface planarization
Soft Au / hard Au plate & brightness
Substrate warpage control
- Specifications

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Line and Space |
0.040mm / 0.040mm |
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Surface Finish |
Hard Au 5um/0.5um, Soft Au 5um/0.3um |
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- Applications


Flash Memory Card