For over 10 years, SEP has been producing single to multilayer constructions of both Flexible and Rigid-Flexible circuits. We have a core flex circuit engineering team that supports the latest in customer concepts for this technology, bringing the toughest designs to market. Our capability focus is with fine line and space, HDI features, static and dynamic bending, and compact designs.

• Feature
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• Fine line and space
• Single to multi-layer constructions
• Rigid-flex constructions
• HDI features
• Static and dynamic bending
• Compact design through hidden VIA hole

• Specifications
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• Applications
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• Mobile Phone
• Camera Module
• LCD Module
• Military Equipment
• Medical Device