이미지3

pcb

  • HDI
  • >
  • Package Substrate
  • >
  • Flex/Rigid-Flex
  • >
  • Backplane
  • >
  • Probecard
  • >
  • Heatsink and Metal Core
  • >
  • Heavy Copper
  • >
  • RF/Microwave
  • >
  • HOME > PCB > Backplane
  • Backplane

With our combined backplane and assembly capabilities, SEP is structured to provide custom backplane solutions that deliver performance and overall value. Our key capabilities include the use of high performance materials for digital designs, variable copper weights to support high speed signals or power within a single design, edge plating, pulse plating, and back drilling.

  • Feature
  • 타이틀라인
backplane
  • 아이콘 Largest panel format 800mm x 600mm
  • 아이콘 Board thickness up to 8mm
  • 아이콘 High layer count up to 60 layers
  • 아이콘 Backdrilling multiple depths from both sides
  • Specifications
  • 타이틀라인
Item Specifications
Material FR4, High Tg
Layer count Max 60
Line and Space 0.100mm / 0.100mm
Board Thickness Max 8mm
Board Size 800mm x 610mm
  • Applications타이틀라인
  • applicaiton
  • 아이콘 Telecommunication
  • 아이콘 High-end Computing
  • 아이콘 Industrial Equipment