With our combined backplane and assembly capabilities, SEP is structured to provide custom backplane solutions that deliver performance and overall value. Our key capabilities include the use of high performance materials for digital designs, variable copper weights to support high speed signals or power within a single design, edge plating, pulse plating, and back drilling.

• Feature
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• Largest panel format 800mm x 600mm
• Board thickness up to 8mm
• High layer count up to 60 layers
• Backdrilling multiple depths from both sides

• Specifications
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• Applications
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• Telecommunication
• High-end Computing
• Industrial Equipment