Whether using aluminum or other thermal interface materials to provide the necessary thermal management, SEP has the experience in the design and fabrication of heatsink and metal core PCB's to support your requirements.
Feature
Lower Operating Temperatures
Improved Product Durability
Increased Power Density
Increased Thermal Efficiency
Lower Junction Temperatures
Minimize Thermal Impedance
Specifications
Item
Specifications
Material
FR4, Aluminum
Layer count
Max 4
Line and Space
0.100mm / 0.100mm
Board Thickness
Max 3.2mm
Min Hole Size
0.200mm
Applications
LED backlight
Motor Drives
Solid State Relays
Power Conversion
Tel : +82-31-231-2228 Fax : +82-31-231-2229
Address : 2B-19L, 930, Gosaek-Dong, Gwonseon-gu, Suwon-Si, Gyeonggi-Do, Korea
Copyright⒞ 2013 SEP Co., Ltd. All rights reserved.