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아이콘 Material
Isola, Nelco, Rogers, Arlon, 3M, Taconic, GIL, Doosan, Shengyi, ITEQ, Nanya, Kingboard
아이콘 Drill
Min Mech Via Size 0.1

Min Mech Via Land Size

(Diameter Over Drill)

0.3
Min Laser Via Size 0.075

Min Laser Via Land Size

(Diameter over Drill)

0.275
Min Space NPTH to Conductor 0.2
Min Space NPTH to Part Edge 0.2
Mechanical Hole Aspect Ratio 20 : 1
Drill Registration 0.0127
PTH Size Tolerance 0.05
Back-Drilling Yes
Control Depth Drilling Yes
Conductive Filled Vias Yes
Non Conductive Filled Vias Yes
Via Plugging Yes
Via Tenting Yes
Copper Filled Vias Yes
아이콘 Etching
Min Line Width/Space(Inner) 0.05

Min Line Width/Space(Outer)

0.05
Min Space Trace to Pad(Inner) 0.05

Min Space Trace to Pad(Outer)

0.05

Min. positional tol.

– feature to feature

+/-0.0254
아이콘 Cu Plating
Min Starting Copper Foil Weight 0.009

Max Finished Copper Thickness (O/L)

8oz
Max Finished Copper Thickness (I/L) 6oz

Edge Plating

Yes
아이콘 Others
Controlled Impedance Tolerance 5%

Embedded Capacitance & Resistance

Yes
Cavity & Heat Sink Designs Yes
아이콘 Available Reports
Outgoing Inspection Report Yes

Electrical Test

Yes
Microsection Yes

Solderability

Yes
X-ray Fluorescence Yes
Ionic Contamination Yes
Time Domain Reflectometry test (TDR) Yes
FAI Yes
Certificate of Compliance (C of C) Yes
Hi Pot Test Yes
아이콘 Layer Structure
Layer Count 42
Min Board Thickness 0.1016

Max Board Thickness

7.62
Overall Thickness Tolerance 10%
Min Core Thickness 0.0508
Min Dielectric Thickness 0.0254
Layer to layer registration tolerance '+/-0.0254
Mixed dielectric construction Yes
Sequential Lamination Yes
아이콘 PSR & Legend
PSR Registration 0.05

PSR Dam Size

0.05
PSR clearance 0.05

PSR Finish

Gloss, Semi-Gloss, Matte
PSR Colors

Green,White,Black,

Red,Blue,Yellow

Legend width 0.127
LDI Legend printing Yes
아이콘 Finish Plating

PSR RegistrationHASL

(Vertical or Horizontal)

Yes

Lead Free HAS

Yes
OSP Yes

ENIG

(Electroless Nickel/Immersion Gold)

Yes
Electrolytic Soft Gold

Yes

Electrolytic Hard Gold Yes
ENEPIG (Electroless Nickel-Electroless Paladium-Immersion Gold) Yes
Palladium / Immersion Gold Yes
Immersion Silver Yes
Tin Nickel Yes
Selective Gold Yes
Gold edge connector Yes
아이콘 Profile
Maximum Panel Size 580 x 700

Routed Part Size Tolerance

+/- 0.127
V Score, Edge to Copper 0.1778

V Score Angles

35°,45°,60°
Bow & Twist Tolerance

0.6%

Jump Scoring Yes
Edge Milling Yes
Counter Bores / Slot Milling Yes
Countersink Yes
Bevel Yes
Edge Castellation Yes
  • Package Substrate
  • 타이틀라인
아이콘 Material
MGC
아이콘 Drill
Min Mech Via Size 0.075

Min Mech Via Land Size

(Diameter Over Drill)

0.075
Min Laser Via Size 0.06

Min Laser Via Land Size

(Diameter over Drill)

0.26
아이콘 Etching
Min Line Width/Space(Inner) 0.015

Min Line Width/Space(Outer)

0.015
Min Space Trace to Pad(Inner) 0.015

Min Space Trace to Pad(Outer)

0.015
아이콘 Layer Structure
Layer Count 1~8

Min Board Thickness

0.11
Min Core Thickness 0.04
아이콘 Finish Plating

ENIG (Electroless Nickel/

Immersion Gold)

Yes

Electrolytic Soft Gold

Yes

ENEPIG

(Electroless Nickel-Electroless Paladium-Immersion Gold)

Yes

Palladium / Immersion Gold

Yes

Gold edge connector

Yes
  • Flexible / Rigid & Flexible PCB
  • 타이틀라인
아이콘 Material
Dupont, Expanex, SDFlex, 3M, Hanwha
아이콘 Coverlay
Coverlay Registratioin '+/- 0.1

Coverlay Open to Conductor

0.2
Min Coverlay Open Size 0.6

Resin Flow

1
아이콘 Profile
Panel Size  
아이콘 Layer Structure
Max Layer Count 8

Cu Foil Thickness

0.009~0.035
Polyimide Thickness 0.012~0.050
Polyimide Adhesive Thickness 0.015~0.035
Stiffeners FR4, Aluminum, Polyimide, Stainless Steel
아이콘 Punch

Punch Tolerance

'+/- 0.127

Min Hole Size

0.6

Min Rectangle Size

'0.55 x 0.55

Min Hole to Hole

0.25

Min Rec to Rec

0.45

Min trace to edge

0.2
  • Backplane
  • 타이틀라인
아이콘 Drill
Mechanical Hole Aspect Ratio 20 : 1

Back-Drilling

Yes
Control Depth Drilling Yes
아이콘 Profile
Max Panel Size 610 x 910
아이콘 Layer Structure
Max Layer Count 60

Max Board Thickness

10
  • Probecard
  • 타이틀라인
아이콘 Drill
Mechanical Hole Aspect Ratio 20 : 1

Min Mechanical Hole Diameter

Thickness 0.25 Drill 0.012
Thickness 0.189 Drill 0.01
Thickness 0.189 Drill 0.01
아이콘 Profile
Max Panel Size 30 x 23
아이콘 Layer Structure
Max Layer Count 60

Max Board Thickness

0.25
아이콘 Finish Plating
Electrolytic Hard Gold

Max Ni 0.315 mil,

Au 0.05 mil

  • Heatsink and Metal Core
  • 타이틀라인
아이콘 Material
CCAF, Bergquist, Laird, Ventec, Polytronics, ShenYi, ITEQ, KB, Rogers, ISOLA, NELCO
아이콘 Layer Structure
Layer Count 1~2

Copper Thickness

0.5 oz ~ 6 oz

T-Preg Thickness

0.002~0.008

Min Mechanical Hole Diameter

0.016 ~ 0.118
  • Heavy Copper
  • 타이틀라인
아이콘 Layer Structure
Layer Count 16

Max Board Thickness

0.157
아이콘 Cu Plating
Max Finished Copper Thickness (O/L) 12oz

Max Finished Copper Thickness (I/L)

7oz
아이콘 Layer Structure
  Hoz 1oz 2oz 3oz 4oz 5oz 6oz
Min. Conductor Width 0.1 0.125 0.15 0.2 0.25 0.009 0.35
Min. Conductor Spacing 0.1

0.15

0.2 0.3 0.35 0.017 0.5
Min. Pad to Pad Spacing 0.1 0.15 0.2 0.3 0.35 0.017 0.5
Min. Conductor-to-Pad Spacing 0.1 0.15 0.2 0.3 0.35 0.017 0.5
Min. VIA Annular Ring 0.15 0.15 0.2 0.2 0.25 0.013 0.35
Min. Distance - Hole to Board Edge 0.25 0.25 0.25 0.25 0.25 0.01 0.25
  • RF/Microwave
  • 타이틀라인
아이콘 Material
CCAF, Bergquist, Laird, Ventec, Polytronics, ShenYi, ITEQ, KB, Rogers, ISOLA, NELCO