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아이콘 Material
Isola, Nelco, Rogers, Arlon, 3M, Taconic, GIL, Doosan, Shengyi, ITEQ, Nanya, Kingboard
아이콘 Drill
Min Mech Via Size 0.004

Min Mech Via Land Size

(Diameter Over Drill)

0.012
Min Laser Via Size 0.003

Min Laser Via Land Size

(Diameter over Drill)

0.011
Min Space NPTH to Conductor 0.008
Min Space NPTH to Part Edge 0.008
Mechanical Hole Aspect Ratio 20 : 1
Drill Registration 0.0005
PTH Size Tolerance 0.002
Back-Drilling Yes
Control Depth Drilling Yes
Conductive Filled Vias Yes
Non Conductive Filled Vias Yes
Via Plugging Yes
Via Tenting Yes
Copper Filled Vias Yes
아이콘 Etching
Min Line Width/Space(Inner) 0.002

Min Line Width/Space(Outer)

0.002
Min Space Trace to Pad(Inner) 0.002

Min Space Trace to Pad(Outer)

0.002

Min. positional tol.

– feature to feature

'+/- 0.001
아이콘 Cu Plating
Min Starting Copper Foil Weight 0.0004

Max Finished Copper Thickness (O/L)

8oz
Max Finished Copper Thickness (I/L) 6oz

Edge Plating

Yes
아이콘 Others
Controlled Impedance Tolerance 5%

Embedded Capacitance & Resistance

Yes
Cavity & Heat Sink Designs Yes
아이콘 Available Reports
Outgoing Inspection Report Yes

Electrical Test

Yes
Microsection Yes

Solderability

Yes
X-ray Fluorescence Yes
Ionic Contamination Yes
Time Domain Reflectometry test (TDR) Yes
FAI Yes
Certificate of Compliance (C of C) Yes
Hi Pot Test Yes
아이콘 Layer Structure
Layer Count 42
Min Board Thickness 0.004

Max Board Thickness

0.3
Overall Thickness Tolerance  
Min Core Thickness 0.002
Min Dielectric Thickness 0.001
Layer to layer registration tolerance '+/- 0.001
Mixed dielectric construction Yes
Sequential Lamination Yes
아이콘 PSR & Legend
PSR Registration 0.002

PSR Dam Size

0.002
PSR clearance 0.002

PSR Finish

Gloss, Semi-Gloss, Matte
PSR Colors

Green,White,Black,

Red,Blue,Yellow

Legend width 0.005
LDI Legend printing Yes
아이콘 Finish Plating

PSR RegistrationHASL

(Vertical or Horizontal)

Yes

Lead Free HAS

Yes
OSP Yes

ENIG

(Electroless Nickel/Immersion Gold)

Yes
Electrolytic Soft Gold

Yes

Electrolytic Hard Gold Yes
ENEPIG (Electroless Nickel-Electroless Paladium-Immersion Gold) Yes
Palladium / Immersion Gold Yes
Immersion Silver Yes
Tin Nickel Yes
Selective Gold Yes
Gold edge connector Yes
아이콘 Profile
Maximum Panel Size 23" x 28"

Routed Part Size Tolerance

'+/- 0.005
V Score, Edge to Copper 0.007

V Score Angles

35°,45°,60°
Bow & Twist Tolerance

0.6%

Jump Scoring Yes
Edge Milling Yes
Counter Bores / Slot Milling Yes
Countersink Yes
Bevel Yes
Edge Castellation Yes
  • Package Substrate
  • 타이틀라인
아이콘 Material
MGC
아이콘 Drill
Min Mech Via Size 0.003

Min Mech Via Land Size

(Diameter Over Drill)

0.011
Min Laser Via Size 0.0024

Min Laser Via Land Size

(Diameter over Drill)

0.001
아이콘 Etching
Min Line Width/Space(Inner) 0.0006

Min Line Width/Space(Outer)

0.0006
Min Space Trace to Pad(Inner) 0.0006

Min Space Trace to Pad(Outer)

0.0006
아이콘 Layer Structure
Layer Count 1~8

Min Board Thickness

0.0043
Min Core Thickness 0.0016
아이콘 Finish Plating

ENIG (Electroless Nickel/

Immersion Gold)

Yes

Electrolytic Soft Gold

Yes

ENEPIG

(Electroless Nickel-Electroless Paladium-Immersion Gold)

Yes

Palladium / Immersion Gold

Yes

Gold edge connector

Yes
  • Flexible / Rigid & Flexible PCB
  • 타이틀라인
아이콘 Material
Dupont, Expanex, SDFlex, 3M, Hanwha
아이콘 Coverlay
Coverlay Registratioin '+/- 0.004

Coverlay Open to Conductor

0.008
Min Coverlay Open Size 0.024

Resin Flow

0.04
아이콘 Profile
Max Panel Size  
아이콘 Layer Structure
Max Layer Count 8

Cu Foil Thickness

0.00035~0.00138
Polyimide Thickness 0.0005~0.0020
Polyimide Adhesive Thickness 0.0006~0.0014
Stiffeners FR4, Aluminum, Polyimide, Stainless Steel
아이콘 Punch

Punch Tolerance

'+/- 0.005

Min Hole Size

0.0024

Min Rectangle Size

'0.0009 x 0.0009

Min Hole to Hole

0.01

Min Rec to Rec

0.018

Min trace to edge

0.008
  • Backplane
  • 타이틀라인
아이콘 Drill
Mechanical Hole Aspect Ratio 20 : 1

Back-Drilling

Yes
Control Depth Drilling Yes
아이콘 Profile
Max Panel Size 24 x 36
아이콘 Layer Structure
Max Layer Count 60

Max Board Thickness

0.394
  • Probecard
  • 타이틀라인
아이콘 Drill
Mechanical Hole Aspect Ratio 20 : 1

Min Mechanical Hole Diameter

Thickness 0.25 Drill 0.012
Thickness 0.189 Drill 0.01
Thickness 0.126 Drill 0.08
아이콘 Profile
Max Panel Size 30 x 23
아이콘 Layer Structure
Max Layer Count 60

Max Board Thickness

0.25
아이콘 Finish Plating
Electrolytic Hard Gold

Max Ni 0.315 mil,

Au 0.05 mil

  • Heatsink and Metal Core
  • 타이틀라인
아이콘 Material
CCAF, Bergquist, Laird, Ventec, Polytronics, ShenYi, ITEQ, KB, Rogers, ISOLA, NELCO
아이콘 Layer Structure
Layer Count 1~2

Copper Thickness

0.5 oz ~ 6 oz

T-Preg Thickness

0.002~0.008

Min Mechanical Hole Diameter

0.016 ~ 0.118
  • Heavy Copper
  • 타이틀라인
아이콘 Layer Structure
Layer Count 16

Max Board Thickness

0.157
아이콘 Cu Plating
Max Finished Copper Thickness (O/L) 12oz

Max Finished Copper Thickness (I/L)

7oz
아이콘 Layer Structure
  Hoz 1oz 2oz 3oz 4oz 5oz 6oz
Min. Conductor Width 0.004 0.005 0.006 0.008 0.01 0.009 0.014
Min. Conductor Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.02
Min. Pad to Pad Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.02
Min. Conductor-to-Pad Spacing 0.004 0.006 0.008 0.012 0.014 0.017 0.02
Min. VIA Annular Ring 0.005 0.006 0.008 0.008 0.01 0.013 0.014
Min. Distance - Hole to Board Edge 0.01 0.01 0.01 0.01 0.01 0.01 0.01
  • RF/Microwave
  • 타이틀라인
아이콘 Material
CCAF, Bergquist, Laird, Ventec, Polytronics, ShenYi, ITEQ, KB, Rogers, ISOLA, NELCO