Crucial to the overall success of delivering a robust and reliable end product, is testing the product. At SEP we have invested in personnel and equipment to ensure the highest level of test capability. At the PCB level, we perform electrical test on 100% of all product built. For Assembly testing we highly recommend a customer driven solution for test that is maintained and supported by SEP.
Design for test (DFT) is important to incorporate early on during the design stages. SEP can support DFT at the initial stages of specifying test parameters for a product and ensure that a fully developed test solution is in place for volume production.
Printed Circuit Board Testing Capabilities:
Bareboard test (100% net list)
Universal bed of nails
Customer bed of nails with dedicated fixture
Flying probe
TDR (polar) Impedance verification and modeling
Hi-pot
SEM/EDS
X-Ray
Thermal Shock
Thermo-hygrostat
Flexibility Test
Folding Endurance
Withstanding Voltage
Insulation Resistance
Tensile stress
Salt Spray
XRF
Assembly Testing Capabilities:
Functional Test
Burn In
ICT
Reliability
Custom Designed
Tel : +82-31-231-2228 Fax : +82-31-231-2229
Address : 2B-19L, 930, Gosaek-Dong, Gwonseon-gu, Suwon-Si, Gyeonggi-Do, Korea
Copyright⒞ 2013 SEP Co., Ltd. All rights reserved.