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- Reliability and Testing
- Crucial to the overall success of delivering a robust and reliable end product, is testing the product. At SEP we have invested in personnel and equipment to ensure the highest level of test capability. At the PCB level, we perform electrical test on 100% of all product built. For Assembly testing we highly recommend a customer driven solution for test that is maintained and supported by SEP.
- Design for test (DFT) is important to incorporate early on during the design stages. SEP can support DFT at the initial stages of specifying test parameters for a product and ensure that a fully developed test solution is in place for volume production.
- Printed Circuit Board Testing Capabilities:
Bareboard test (100% net list)- Universal bed of nails
- Customer bed of nails with dedicated fixture
- Flying probe
- TDR (polar) Impedance verification and modeling
- Hi-pot
- SEM/EDS
- X-Ray
- Thermal Shock
- Thermo-hygrostat
- Flexibility Test
- Folding Endurance
- Withstanding Voltage
- Insulation Resistance
- Tensile stress
- Salt Spray
- XRF
- Assembly Testing Capabilities:
- Functional Test
- Burn In
- ICT
- Reliability
- Custom Designed
- Tel : +82-31-231-2228 Fax : +82-31-231-2229
Address : 2B-19L, 930, Gosaek-Dong, Gwonseon-gu, Suwon-Si, Gyeonggi-Do, Korea
Copyright⒞ 2013 SEP Co., Ltd. All rights reserved.
