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About us
Vision
Company profile
History
Management team
Oraganization
Environmental Policy
Design
Product Design&Developmen
Original Design Manufacturing
PCB Design&Engineering
Prototype through Production
New Product Introduction
PCB
HDI
Package Substrate
- CSP (Chip Scale packages)
- FC-CSP (Flip Chip) CSP
- PBGA (Plastic Ball Grid Array)
- BOC (Board on chip)
- FMC (Flash Memory Card)
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Flex/Rigid-Flex
Backplane
Probecard
Heatsink and Metal Core
Heavy Copper PCB
RF/Microwave PCB
ELECTRONICS MANUFACURING SERVICES
PCB Assembly
Compoment Procurement
Cable&Harness
Sheet Metal Fabrication
Plastic Injection Molding
Technology
PCB
EMS
Quality
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Lean Manufacturing&6Sigma
Reliability and Testing
Contact us
Contact us
Tel : +82-31-231-2228 Fax : +82-31-231-2229
Address : 2B-19L, 930, Gosaek-Dong, Gwonseon-gu, Suwon-Si, Gyeonggi-Do, Korea
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